SMIC (Semiconductor Manufacturing International Corp.) and JCET (Jiangsu Changjiang Electronics Technology Co.) announced that a 12" bumping and testing facility will be jointly built in Jiangyin National High-Tech Industrial Development Zone in Jiangsu Province, China, reported China Electronics News on August 12. The US$50 million joint venture is signed back in February 2014, with SMIC and JCET holding 51% and 49% stake, respectively. The facility will begin mass production in 2Q15 or 3Q15, expecting to churn out 10,000 units per month before ramping up to 50,000 units when the establishment is fully completed. Wafer bumping technology is essential to the development of China's semiconductor industry as wafers made in China are currently sent to Taiwan, Singapore, and Korea for bumping services.